The Department of Commerce (DoC) announced Monday it has reached a preliminary agreement with Hemlock Semiconductor (HSC) for up to $325 million in proposed direct funding under the CHIPS and Science Act to support the construction of a new semiconductor-grade polysilicon manufacturing facility on HSC’s existing campus in Hemlock, Mich. […]
The Department of Commerce (DoC) has reached a preliminary agreement with California-based chipmaker Infinera for up to $93 million in CHIPS and Science Act funding to support two facility expansion efforts. […]
The National Science Foundation (NSF) is partnering with the Department of Commerce (DoC) to build out a network that will train skilled workers for good-paying jobs needed in the semiconductor and microelectronics industry over the next decade. […]
The Department of Commerce (DoC) announced today it has reached a preliminary agreement with SK hynix for up to $450 million in proposed direct funding under the CHIPS and Science Act to build a high-bandwidth memory (HBM) packaging plant for AI products and an advanced packaging research and development (R&D) facility. […]
The Commerce Department said today it has reached a non-binding and preliminary agreement with U.S.-based semiconductor manufacturing giant Intel Corp. to provide the company with $8.5 billion of CHIPS and Science Act funding to support chip making projects in Arizona, New Mexico, Ohio, and Oregon. […]
The National Semiconductor Technology Center (NSTC) has selected its new board of trustees from industry and academia – including Intel, Stanford, and IBM – that will focus on overseeing the research and advancement of semiconductor research at the National Institute of Standards and Technology (NIST). […]
The Biden-Harris administration last week appointed six policy leaders to the newly established CHIPS for America offices – which are housed within the White House and the Department of Commerce (DoC) – to lead the way in implementing the CHIPS and Science Act. […]
Sen. Gary Peters, D-Mich., chairman of the Senate Homeland Security and Governmental Affairs Committee, this week urged Congress to move toward final passage of legislation that would provide $52 billion of funding to reinvigorate the U.S. semiconductor industry and aid the domestic automotive industry. […]
The complex legislative process needed to bring congressional leaders together to reconcile differences between Senate-passed and House-passed semiconductor and innovation legislation advanced in the Senate this week, and now stands just a few steps from completion, as lawmakers call for cybersecurity-related components of the bills to make the final cut. […]
President Biden delivered a fresh pitch on Jan. 21 for Congress to take up and pass the Senate-approved United States Innovation and Competition Act (USICA) bill. […]
The September 29 kick-off meeting of the Trade and Technology Council (TTC) created earlier this year by the United States, European Commission, and European Council produced initial commitments by the three parties to coordinate on technology issues including the development of artificial intelligence (AI) technologies, and semiconductor supply chains. […]
New legislation introduced by Sens. Ron Wyden, D-Ore., and Mike Crapo, R-Idaho, would create a 25 percent tax credit for investments in U.S. semiconductor manufacturing to boost domestic manufacturing of semiconductors and further the aims of a major push in Congress to stimulate domestic growth in that sector. […]