The Department of Commerce (DoC) issued a Notice of Funding Opportunity (NOFO) on Oct. 18, officially opening a competition with up to $1.6 billion in funding to support research and development (R&D) activities for semiconductor advanced packaging. […]

The Biden administration released its vision this week to boost U.S. semiconductor capabilities, announcing a $3 billion program to advance packaging – a key technology for manufacturing semiconductors, or chips. […]

The U.S. Department of Commerce’s National Institute of Standards and Technology (NIST) today launched the first CHIPS for America funding opportunity for manufacturing incentives to restore U.S. leadership in semiconductor manufacturing, support jobs across the semiconductor supply chain, and advance U.S. economic and national security.   […]