The Department of Commerce and Natcast, the operator of the National Semiconductor Technology Center (NSTC), announced this week the first two expected locations that will house CHIPS for America research and development (R&D) flagship facilities. […]

The Department of Commerce (DoC) announced Monday it has reached a preliminary agreement with Hemlock Semiconductor (HSC) for up to $325 million in proposed direct funding under the CHIPS and Science Act to support the construction of a new semiconductor-grade polysilicon manufacturing facility on HSC’s existing campus in Hemlock, Mich. […]

The Department of Commerce (DoC) issued a Notice of Funding Opportunity (NOFO) on Oct. 18, officially opening a competition with up to $1.6 billion in funding to support research and development (R&D) activities for semiconductor advanced packaging. […]

The Department of Commerce (DoC) has reached a preliminary agreement with California-based chipmaker Infinera for up to $93 million in CHIPS and Science Act funding to support two facility expansion efforts.  […]

The Department of Commerce (DoC) announced today it has reached a preliminary agreement with Wolfspeed, Inc., for up to $750 million in proposed direct funding under the CHIPS and Science Act to support the construction of a new silicon carbide wafer manufacturing facility in North Carolina. […]

The Biden administration announced on Wednesday the launch of the National Semiconductor Technology Center’s (NSTC) Workforce Center of Excellence (WCoE) in an effort to improve the development of the U.S. semiconductor workforce. […]

The Department of Commerce this week rolled out its new SCALE supply chain risk assessment tool that the agency said will increase the government’s ability to be “more proactive and strategic” about assessing structural supply chain risks across the country.   […]

The Commerce Department is set to publish a proposed rule on Wednesday that aims to implement reporting requirements for U.S. companies regarding the development of dual-use foundation artificial intelligence (AI) models.  […]

The National Telecommunications and Information Administration (NTIA) wants more information on the challenges surrounding data center growth, resilience, and security “amidst a surge of computing power demand due to the development of critical and emerging technologies.” […]

The National Oceanic and Atmospheric Administration (NOAA) has received $100 million in Federal funding to help pay for a new high-performance computer (HPC) system that will harness artificial intelligence and machine learning (AI/ML) capabilities to tackle advanced climate and weather research.   […]

The United States Patent and Trademark Office (USPTO) has awarded a $75 million contract to Accenture Federal Services (AFS) to scale the use of artificial intelligence and modernize the patent examination process.   […]

The Department of Commerce (DoC) announced today it has reached a preliminary agreement with HP Inc. for up to $50 million in proposed direct funding under the CHIPS and Science Act to support the expansion of HP’s existing semiconductor facility in Corvallis, Ore. […]

The Commerce Department announced today it has signed another blockbuster funding deal under the CHIPS and Science Act for up to $1.6 billion in proposed direct funding for Texas Instruments (TI) to expand its production of semiconductors. […]

A new report out today by the Department of Commerce’s National Telecommunications and Information Administration (NTIA) calls on the Federal government to implement several policy recommendations focused on embracing openness in AI while also calling for active monitoring of risks in powerful AI models. […]

The Department of Commerce (DoC) announced today it has reached a preliminary agreement with Amkor Technology for up to $400 million in proposed direct funding under the CHIPS and Science Act to support cutting-edge advanced packaging technology. […]

The Commerce Department said today it signed a non-binding preliminary memorandum with GlobalWafers Co. Ltd. for up to $400 million in funding approved under the CHIPS and Science Act that the company would use to create semiconductor wafer operations in the United States. […]

The chief human capital officer (CHCO) at the Department of Commerce said today that generative AI (GenAI) technologies appear to have a bright future in how government agencies undertake their human resource management work. […]

The U.S. Patent and Trademark Office (USPTO) issued a guidance update today on patent subject matter eligibility to address innovation in critical and emerging technologies, including in artificial intelligence (AI). […]

The Department of Commerce (DoC) announced on Tuesday that it is launching a competition with up to $1.6 billion in funding, authorized under the CHIPS and Science Act, to support research and development (R&D) activities for semiconductor advanced packaging. […]

The Biden administration, through the Department of Commerce’s Economic Development Administration (EDA), announced today $504 million in implementation grants for a dozen technology hubs across the country as part of the second phase of the Tech Hubs program. […]

The Department of Commerce (DoC) announced today it has reached a preliminary agreement with Rogue Valley Microdevices (RVM) for up to $6.7 million in direct funding under the CHIPS and Science Act to support the construction of a new semiconductor factory. […]

The Commerce Department’s National Telecommunications and Information Administration (NTIA) component could be doing more to help Tribal authorities with technical assistance as they seek to create and improve broadband services using $3 billion in funding from the Federal government’s Tribal Broadband Connectivity Program (TBCP), according to a new report from the Government Accountability Office (GAO). […]

The Commerce Department’s U.S. Patent and Trademark Office (USPTO) recently announced a new National Strategy for Inclusive Innovation to connect more Americans with resources to spur innovation and entrepreneurship. […]

The Department of Commerce announced today it has reached a preliminary agreement with Entegris for up to $75 million in proposed Federal incentives under the CHIPS and Science Act to onshore critical semiconductor supply chain and manufacturing materials for leading-edge chip production. […]

The Department of Commerce announced today it has reached a preliminary agreement with Rocket Lab, the parent company of space power provider SolAero Technologies Corp., for up to $23.9 million in direct funding under the CHIPS and Science Act to expand the production of compound semiconductors that power spacecrafts and satellites. […]

The National Oceanic and Atmospheric Administration (NOAA) is turning to artificial intelligence (AI), cloud, and high-performance computing technologies to better forecast and disseminate weather and climate information, NOAA Administrator Rick Spinrad said on June 4. […]

The Commerce Department said on May 23 that it has reached a preliminary agreement with Absolics to provide the company with $75 million of CHIPS and Science Act funding that will support the company’s construction of a facility in Covington, Ga., where it will develop substrates technology for use in advanced semiconductor manufacturing. […]

The Department of Commerce announced today that it has entered into a preliminary agreement with Polar Semiconductor to provide the company with $120 million under the CHIPS and Science Act to expand the company’s semiconductor manufacturing facility in Bloomington, Minnesota. […]

While the 2030 Census is still years away, a new Government Accountability Office (GAO) report reveals the U.S. Census Bureau still has some work to do to improve its IT modernization efforts critical to that mission. […]

The Department of Commerce announced today it has reached a preliminary agreement with Micron Technology for up to $6.14 billion in direct funding under the CHIPS and Science Act to build leading-edge memory semiconductors in the United States. […]